onsemi ArrayJ-60035-4P-BGA 4-Element Photomultiplier Photomultiplier, Surface BGA package

ON Semiconductor's J-Series silicon photomultiplier (SiPM) sensors have been used to create high fill-factor, scalable arrays. The TSV-packaged sensors are mounted onto PCB boards with minimal dead space. The ArrayJ products are available in a variety of formats and formed of either 3 mm, 4 mm or 6 mm pixels. The back of each ArrayJ has either one or more multi-way connectors or a BGA (ball grid array) that allow access to each pixels standard output, and in some cases, the fast output as well.

• High fill-factor, scalable arrays
• Variety of formats ranging from 2x2 to 8x8
• Minimal deadspace, with fill factors of >90%
• Each array as either a multi-way connector or BGA on the reverse for access to all signals
• The pixel signals can either be read out individually for imaging applications, or summed by the user to create a large area, single-channel sensor
• The pixel-level performance is exactly as per that of the individual J-Series sensors
• Optional evaluation boards are available for easy access to signals
• Applications
• Medical Imaging
• Hazard & Threat
• 3D Ranging & Sensing
• Biophotonics & Sciences
• High Energy Physics