Технически документи
Спецификации
Brand
MicrochipProduct Type
Microcontroller
Series
PIC XLP 16F
Package Type
DIP
Mount Type
Surface
Pin Count
28
Device Core
PIC
Data Bus Width
8bit
Program Memory Size
28kB
Maximum Clock Frequency
32MHz
RAM Size
2kB
Maximum Supply Voltage
5.5V
Number of Programmable I/Os
25
DACs
1 x 5 Bit
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Standards/Approvals
REACH, RoHS3
Width
7.62mm
Minimum Supply Voltage
2.3V
Number of Timers
2
Instruction Set Architecture
RISC
Automotive Standard
No
ADCs
24 x 10 Bit
Program Memory Type
FLASH
Детайли за продукта
The Microchip microcontroller features analog, core independent peripherals and communication peripherals, combined with eXtreme low power (XLP) technology for a wide range of general purpose and low power applications. The devices feature multiple PWMs, multiple communication, temperature sensor, and memory features like Memory Access Partition (MAP) to support customers in data protection and bootloader applications, and Device Information Area (DIA) which stores factory calibration values to help improve temperature sensor accuracy.
Информацията за складовите наличности временно не е налична.
€ 20,62
€ 1,375 Each (In a Tube of 15) (ex VAT)
15
€ 20,62
€ 1,375 Each (In a Tube of 15) (ex VAT)
Информацията за складовите наличности временно не е налична.
15
Технически документи
Спецификации
Brand
MicrochipProduct Type
Microcontroller
Series
PIC XLP 16F
Package Type
DIP
Mount Type
Surface
Pin Count
28
Device Core
PIC
Data Bus Width
8bit
Program Memory Size
28kB
Maximum Clock Frequency
32MHz
RAM Size
2kB
Maximum Supply Voltage
5.5V
Number of Programmable I/Os
25
DACs
1 x 5 Bit
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Standards/Approvals
REACH, RoHS3
Width
7.62mm
Minimum Supply Voltage
2.3V
Number of Timers
2
Instruction Set Architecture
RISC
Automotive Standard
No
ADCs
24 x 10 Bit
Program Memory Type
FLASH
Детайли за продукта
The Microchip microcontroller features analog, core independent peripherals and communication peripherals, combined with eXtreme low power (XLP) technology for a wide range of general purpose and low power applications. The devices feature multiple PWMs, multiple communication, temperature sensor, and memory features like Memory Access Partition (MAP) to support customers in data protection and bootloader applications, and Device Information Area (DIA) which stores factory calibration values to help improve temperature sensor accuracy.