Технически документи
Спецификации
Brand
STMicroelectronicsProduct Type
Chip Balun
Balance Impedance
100Ω
Maximum Insertion Loss
1.2dB
Mount Type
Surface
Pin Count
6
Maximum Frequency
8GHz
Minimum Frequency
3GHz
Minimum Operating Temperature
-40°C
Package Type
Bumpless CSP
Maximum Operating Temperature
105°C
Standards/Approvals
No
Length
1.825mm
Страна на произход
China
Детайли за продукта
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
Информацията за складовите наличности временно не е налична.
€ 9,42
€ 0,377 Each (In a Pack of 25) (ex VAT)
Стандарт
25
€ 9,42
€ 0,377 Each (In a Pack of 25) (ex VAT)
Информацията за складовите наличности временно не е налична.
Стандарт
25
| количество | Единична цена | Per Опаковка |
|---|---|---|
| 25 - 75 | € 0,377 | € 9,42 |
| 100 - 225 | € 0,366 | € 9,16 |
| 250 - 475 | € 0,352 | € 8,81 |
| 500 - 975 | € 0,341 | € 8,52 |
| 1000+ | € 0,328 | € 8,19 |
Технически документи
Спецификации
Brand
STMicroelectronicsProduct Type
Chip Balun
Balance Impedance
100Ω
Maximum Insertion Loss
1.2dB
Mount Type
Surface
Pin Count
6
Maximum Frequency
8GHz
Minimum Frequency
3GHz
Minimum Operating Temperature
-40°C
Package Type
Bumpless CSP
Maximum Operating Temperature
105°C
Standards/Approvals
No
Length
1.825mm
Страна на произход
China
Детайли за продукта
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
