Технически документи
Спецификации
Brand
STMicroelectronicsProduct Type
Power Board
Power Management Function
Power Management
For Use With
STM32
Kit Classification
Adapter Board
Featured Device
STLINK-V3SET
Kit Name
Isolation and Voltage Adapter Board for STLINK-V3SET
Standards/Approvals
2.5 kVrms insulation rating, 300 Vrms basic insulation working voltage per IEC 62368‐1:2014
Детайли за продукта
The STMicroelectronics B-STLINK-ISOL board is an additional module for STLINK-V3SET, performing galvanic isolation and voltage adaptation for STM32 microcontroller targets running below 3.3 V down to 1.65 V. The module can be enclosed directly in the original STLINK-V3SET casing, when used as an STM32 debugging probe (JTAG/SWD/SWV/VCP) through the STDC14 connector. It can be also inserted between the STLINK-V3SET main board (MB1441) and its adapter board (MB1440) when providing access to bridge signals and other connectors.
Информацията за складовите наличности временно не е налична.
€ 91,07
€ 91,07 Всеки (ex VAT)
1
€ 91,07
€ 91,07 Всеки (ex VAT)
Информацията за складовите наличности временно не е налична.
1
Технически документи
Спецификации
Brand
STMicroelectronicsProduct Type
Power Board
Power Management Function
Power Management
For Use With
STM32
Kit Classification
Adapter Board
Featured Device
STLINK-V3SET
Kit Name
Isolation and Voltage Adapter Board for STLINK-V3SET
Standards/Approvals
2.5 kVrms insulation rating, 300 Vrms basic insulation working voltage per IEC 62368‐1:2014
Детайли за продукта
The STMicroelectronics B-STLINK-ISOL board is an additional module for STLINK-V3SET, performing galvanic isolation and voltage adaptation for STM32 microcontroller targets running below 3.3 V down to 1.65 V. The module can be enclosed directly in the original STLINK-V3SET casing, when used as an STM32 debugging probe (JTAG/SWD/SWV/VCP) through the STDC14 connector. It can be also inserted between the STLINK-V3SET main board (MB1441) and its adapter board (MB1440) when providing access to bridge signals and other connectors.
