nVent SCHROFF, 4U, 19-Inch Rack Mount Case, Comptec Ventilated, 211 x 520 x 500mm
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Технически документи
Спецификации
Ventilated
Yes
External Case Material
Aluminium, Steel
Rack Units
4U
Frame Depth
476mm
Colour
Grey, White
Series
Comptec
External Depth
500mm
External Height
211 mm
External Width
520 mm
Brand
nVent SchroffExternal Dimensions
211 x 520 x 500mm
Страна на произход
Germany
Детайли за продукта
Murata GQM 0805 Series
Chip monolithic ceramic capacitor
High Q and low ESR at VHF, UHF & Microwave frequencies
Suitable for flow/reflow soldering
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
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€ 308,70
Всеки (ex VAT)
1
€ 308,70
Всеки (ex VAT)
1
Технически документи
Спецификации
Ventilated
Yes
External Case Material
Aluminium, Steel
Rack Units
4U
Frame Depth
476mm
Colour
Grey, White
Series
Comptec
External Depth
500mm
External Height
211 mm
External Width
520 mm
Brand
nVent SchroffExternal Dimensions
211 x 520 x 500mm
Страна на произход
Germany
Детайли за продукта
Murata GQM 0805 Series
Chip monolithic ceramic capacitor
High Q and low ESR at VHF, UHF & Microwave frequencies
Suitable for flow/reflow soldering
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.