Amphenol RF, jack Through Hole MMCX Connector, 50Ω, Solder Termination, Straight Body
Технически документи
Спецификации
Gender
Female
Impedance
50Ω
Body Plating
Gold
Body Orientation
Straight
Contact Material
Beryllium Copper
Funnel Diameter
180mm
Operating Frequency
0 to 6GHz
Contact Plating
Gold
Termination Method
Solder
Model
Whad HE 6000Mounting Type
Through Hole
Детайли за продукта
Advanced Power MOSFET, Fairchild Semiconductor
Avalanche Rugged Technology
Rugged Gate Oxide Technology
Lower Input Capacitance
Improved Gate Charge
MOSFET Transistors, ON Semi
ON Semi offers a substantial portfolio of MOSFET devices that includes high-voltage (>250V) and low-voltage (<250V) types. The advanced silicon technology provides smaller die sizes, which it is incorporated into multiple industry-standard and thermally-enhanced packages.
ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.
Информацията за складовите наличности временно не е налична.
Моля, проверете отново по-късно.
€ 3,797
Each (In a Bag of 100) (ex VAT)
100
€ 3,797
Each (In a Bag of 100) (ex VAT)
100
Технически документи
Спецификации
Gender
Female
Impedance
50Ω
Body Plating
Gold
Body Orientation
Straight
Contact Material
Beryllium Copper
Funnel Diameter
180mm
Operating Frequency
0 to 6GHz
Contact Plating
Gold
Termination Method
Solder
Model
Whad HE 6000Mounting Type
Through Hole
Детайли за продукта
Advanced Power MOSFET, Fairchild Semiconductor
Avalanche Rugged Technology
Rugged Gate Oxide Technology
Lower Input Capacitance
Improved Gate Charge
MOSFET Transistors, ON Semi
ON Semi offers a substantial portfolio of MOSFET devices that includes high-voltage (>250V) and low-voltage (<250V) types. The advanced silicon technology provides smaller die sizes, which it is incorporated into multiple industry-standard and thermally-enhanced packages.
ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.