TE Connectivity Backplane Connector Through Hole, 4, 250 V 10A
Технически документи
Спецификации
Brand
TE ConnectivityProduct Type
Backplane Connector
Pole Format
4
Current
10A
Voltage
250 V
Connector Gender
Female
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Housing Material
Polyethylene Terephthalate
Minimum Operating Temperature
-55°C
Contact Plating
Gold over Palladium Nickel over Nickel
Contact Gender
Female
Maximum Operating Temperature
125°C
Standards/Approvals
No
Страна на произход
United States
Детайли за продукта
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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Информацията за складовите наличности временно не е налична.
€ 9,88
€ 9,88 Всеки (ex VAT)
Стандарт
1
€ 9,88
€ 9,88 Всеки (ex VAT)
Информацията за складовите наличности временно не е налична.
Стандарт
1
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Технически документи
Спецификации
Brand
TE ConnectivityProduct Type
Backplane Connector
Pole Format
4
Current
10A
Voltage
250 V
Connector Gender
Female
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Housing Material
Polyethylene Terephthalate
Minimum Operating Temperature
-55°C
Contact Plating
Gold over Palladium Nickel over Nickel
Contact Gender
Female
Maximum Operating Temperature
125°C
Standards/Approvals
No
Страна на произход
United States
Детайли за продукта
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products