Технически документи
Спецификации
Brand
TE ConnectivityBackplane Connector Type
3 Pair, High Speed Hard Metric
Gender
Female
Number Of Contacts
60
Number of Columns
10
Number Of Rows
6
Body Orientation
Right Angle
Housing Material
Glass Fibre Reinforced PET
Pitch
2.5mm
Contact Material
Copper Nickel Silicon Alloy
Mounting Type
Through Hole
Contact Plating
Gold over Nickel
Current Rating
700mA
Voltage Rating
250 V ac
Termination Method
Solder
Series
Z-PACK HM-Zd
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+105°C
Детайли за продукта
TE Connectivity Z-PACK™ HM-Zd Headers and Connector Assemblies
Z-PACK™ HM-Zd headers and connector assemblies with a 2.50mm centerline. These Z-PACK™ HM-Zd Pin headers and receptacle connector assemblies are press fit PCB through hole mounting and have polyester GF housings.
HM-Zd is the backplane interconnect for PICMG 3.x (ATCA) industry standard
High speed, differential, board to backplane electrical connectors
Provides a differential solution for applications in the range 3 to 6.4 Gb/s
Extension of IEC61076-4-101
Standards
PICMG
€ 406,45
€ 20,323 Each (In a Tube of 20) (ex VAT)
20
€ 406,45
€ 20,323 Each (In a Tube of 20) (ex VAT)
20
Информацията за складовите наличности временно не е налична.
Моля, проверете отново по-късно.
Технически документи
Спецификации
Brand
TE ConnectivityBackplane Connector Type
3 Pair, High Speed Hard Metric
Gender
Female
Number Of Contacts
60
Number of Columns
10
Number Of Rows
6
Body Orientation
Right Angle
Housing Material
Glass Fibre Reinforced PET
Pitch
2.5mm
Contact Material
Copper Nickel Silicon Alloy
Mounting Type
Through Hole
Contact Plating
Gold over Nickel
Current Rating
700mA
Voltage Rating
250 V ac
Termination Method
Solder
Series
Z-PACK HM-Zd
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+105°C
Детайли за продукта
TE Connectivity Z-PACK™ HM-Zd Headers and Connector Assemblies
Z-PACK™ HM-Zd headers and connector assemblies with a 2.50mm centerline. These Z-PACK™ HM-Zd Pin headers and receptacle connector assemblies are press fit PCB through hole mounting and have polyester GF housings.
HM-Zd is the backplane interconnect for PICMG 3.x (ATCA) industry standard
High speed, differential, board to backplane electrical connectors
Provides a differential solution for applications in the range 3 to 6.4 Gb/s
Extension of IEC61076-4-101
Standards
PICMG