TE Connectivity, Z-PACK 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way

Номер на артикул на RS: 718-1544Марка: TE Connectivity№ по каталога на производителя: 120954-1
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Технически документи

Спецификации

Number Of Contacts

4

Number Of Rows

1

Body Orientation

Right Angle

Pitch

2mm

Contact Material

Copper Alloy

Mounting Type

Through Hole

Contact Plating

Gold

Current Rating

16A

Termination Method

Press Fit

Series

Z-PACK

Страна на произход

United States

Детайли за продукта

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

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€ 8,76

€ 8,76 Всеки (ex VAT)

TE Connectivity, Z-PACK 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way
Изберете тип опаковка

€ 8,76

€ 8,76 Всеки (ex VAT)

TE Connectivity, Z-PACK 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way

Информацията за складовите наличности временно не е налична.

Изберете тип опаковка

Информацията за складовите наличности временно не е налична.

количествоЕдинична цена
1 - 19€ 8,76
20 - 74€ 8,33
75 - 299€ 7,91
300 - 599€ 7,60
600+€ 7,41

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Технически документи

Спецификации

Number Of Contacts

4

Number Of Rows

1

Body Orientation

Right Angle

Pitch

2mm

Contact Material

Copper Alloy

Mounting Type

Through Hole

Contact Plating

Gold

Current Rating

16A

Termination Method

Press Fit

Series

Z-PACK

Страна на произход

United States

Детайли за продукта

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more