Технически документи
Спецификации
Brand
TDKInductance
10 μH
Maximum dc Current
1.33A
Package/Case
4012
Length
4mm
Depth
4mm
Height
1.2mm
Dimensions
4 x 4 x 1.2mm
Shielded
Yes
Tolerance
±20%
Maximum DC Resistance
228mΩ
Series
VLS-E
Core Material
Ferrite
Maximum Operating Temperature
+105°C
Minimum Operating Temperature
-40°C
Страна на произход
Japan
Детайли за продукта
VLS-E series Shielded Magnetic Power Choke
Professional range of TDK magnetic shield wound inductor for power circuits from the VLS-E series and compatible with high density mounting.
Features and Benefits:
The VLS-E series have a low profile product lineup with max. heights of 0.8 mm, 0.95 mm, 1.0 mm, 1.2 mm, and 1.5 mm allowing for various applications
High magnetic shield construction and compatible with high density mounting
Applications:
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices and compact power supply modules
TDK Non Standard SMT Inductors (Chokes)
Информацията за складовите наличности временно не е налична.
Запитване за цена
Each (On a Reel of 1000) (ex VAT)
1000
Запитване за цена
Each (On a Reel of 1000) (ex VAT)
Информацията за складовите наличности временно не е налична.
1000
Технически документи
Спецификации
Brand
TDKInductance
10 μH
Maximum dc Current
1.33A
Package/Case
4012
Length
4mm
Depth
4mm
Height
1.2mm
Dimensions
4 x 4 x 1.2mm
Shielded
Yes
Tolerance
±20%
Maximum DC Resistance
228mΩ
Series
VLS-E
Core Material
Ferrite
Maximum Operating Temperature
+105°C
Minimum Operating Temperature
-40°C
Страна на произход
Japan
Детайли за продукта
VLS-E series Shielded Magnetic Power Choke
Professional range of TDK magnetic shield wound inductor for power circuits from the VLS-E series and compatible with high density mounting.
Features and Benefits:
The VLS-E series have a low profile product lineup with max. heights of 0.8 mm, 0.95 mm, 1.0 mm, 1.2 mm, and 1.5 mm allowing for various applications
High magnetic shield construction and compatible with high density mounting
Applications:
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices and compact power supply modules


