Технически документи
Спецификации
Brand
SamtecNumber Of Contacts
120
Number Of Rows
2
Pitch
0.8mm
Type
Board to Board
Mounting Type
Surface Mount
Body Orientation
Straight
Termination Method
Solder
Current Rating
1.4A
Voltage Rating
200 V
Series
ERF8
Contact Material
Beryllium Copper
Детайли за продукта
ERF8 Series Rugged High Speed Sockets
These Board to Board ERF8 Series, SMT, 0.8 mm pitch high speed Sockets from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERF8 Series, SMT, 0.8 mm pitch high speed Sockets have an above board height of 5.1 mm.
Insulator material: Black LCP
Operating temperature: -55 → 125 °C
0.8mm Board to Board - Samtec
Информацията за складовите наличности временно не е налична.
Запитване за цена
Производствен пакет (Ролка)
1
Запитване за цена
Информацията за складовите наличности временно не е налична.
Производствен пакет (Ролка)
1
Технически документи
Спецификации
Brand
SamtecNumber Of Contacts
120
Number Of Rows
2
Pitch
0.8mm
Type
Board to Board
Mounting Type
Surface Mount
Body Orientation
Straight
Termination Method
Solder
Current Rating
1.4A
Voltage Rating
200 V
Series
ERF8
Contact Material
Beryllium Copper
Детайли за продукта
ERF8 Series Rugged High Speed Sockets
These Board to Board ERF8 Series, SMT, 0.8 mm pitch high speed Sockets from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERF8 Series, SMT, 0.8 mm pitch high speed Sockets have an above board height of 5.1 mm.
Insulator material: Black LCP
Operating temperature: -55 → 125 °C


