Heatsink, Universal Square Alu, 0.83°C/W, 100 x 100 x 15mm, PCB Mount

Номер на артикул на RS: 903-3087Марка: RS PRO
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Технически документи

Спецификации

Brand

RS Pro

For Use With

Universal Square Alu

Length

100mm

Width

100mm

Height

15mm

Dimensions

100 x 100 x 15mm

Thermal Resistance

0.83°C/W

Mounting

PCB Mount

Series

100

Application

High Power Semiconductor Device, Optoelectronic Device

Material

Aluminium

Finish

Anodized

Страна на произход

United Kingdom

Детайли за продукта

Heat Sink 109AB Series, 100mm Wide x 15mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.

Информацията за складовите наличности временно не е налична.

Моля, проверете отново по-късно.

Информацията за складовите наличности временно не е налична.

€ 13,15

Всеки (ex VAT)

Heatsink, Universal Square Alu, 0.83°C/W, 100 x 100 x 15mm, PCB Mount

€ 13,15

Всеки (ex VAT)

Heatsink, Universal Square Alu, 0.83°C/W, 100 x 100 x 15mm, PCB Mount
Информацията за складовите наличности временно не е налична.

Купете в насипно състояние

количествоЕдинична цена
1 - 9€ 13,15
10 - 24€ 12,10
25 - 49€ 11,57
50 - 99€ 11,16
100+€ 10,25

Технически документи

Спецификации

Brand

RS Pro

For Use With

Universal Square Alu

Length

100mm

Width

100mm

Height

15mm

Dimensions

100 x 100 x 15mm

Thermal Resistance

0.83°C/W

Mounting

PCB Mount

Series

100

Application

High Power Semiconductor Device, Optoelectronic Device

Material

Aluminium

Finish

Anodized

Страна на произход

United Kingdom

Детайли за продукта

Heat Sink 109AB Series, 100mm Wide x 15mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.