100Ω RS PRO Surface Mount Chip Balun

Номер на артикул на RS: 884-2256Марка: RS PRO
brand-logo
Преглед на всички в Чип балуни

Технически документи

Спецификации

Brand

RS Pro

Unbalance Impedance

50Ω

Balance Impedance

100Ω

Maximum Insertion Loss

1.2dB

Mounting Type

Surface Mount

Pin Count

6

Dimensions

1.6 x 0.8 x 0.7mm

Height

0.7mm

Length

1.6mm

Width

0.8mm

Maximum Frequency

2.5GHz

Minimum Frequency

2400MHz

Maximum Operating Temperature

+85°C

Minimum Operating Temperature

-40°C

Страна на произход

Taiwan, Province Of China

Детайли за продукта

RS Multilayer Chip Baluns, RFBLN Series, 1608(0603)

RS Pro range offers RFBLN Series – 1608(0603) Multilayer Ceramic Balun Transformer.

Features and Benefits:

2.4 GHz ISM Band Working Frequency
Multilayer LTCC (Low Temperature Co-fired Ceramics) Technology
Miniature Size: 1.6 x 0.8 x 0.7 mm³
Low Insertion Loss reduces power consumption
Low Inband Amplitude and Phase imbalance enable high performance wireless system operation
Enable for DC Biasing of PA or Mixer
Unbalance impedance is upon request

Applications:

2.4 GHz ISM Band RF and Bluetooth, Wireless LAN, HomeRF

Информацията за складовите наличности временно не е налична.

Моля, проверете отново по-късно.

Информацията за складовите наличности временно не е налична.

P.O.A.

100Ω RS PRO Surface Mount Chip Balun

P.O.A.

100Ω RS PRO Surface Mount Chip Balun
Информацията за складовите наличности временно не е налична.

Технически документи

Спецификации

Brand

RS Pro

Unbalance Impedance

50Ω

Balance Impedance

100Ω

Maximum Insertion Loss

1.2dB

Mounting Type

Surface Mount

Pin Count

6

Dimensions

1.6 x 0.8 x 0.7mm

Height

0.7mm

Length

1.6mm

Width

0.8mm

Maximum Frequency

2.5GHz

Minimum Frequency

2400MHz

Maximum Operating Temperature

+85°C

Minimum Operating Temperature

-40°C

Страна на произход

Taiwan, Province Of China

Детайли за продукта

RS Multilayer Chip Baluns, RFBLN Series, 1608(0603)

RS Pro range offers RFBLN Series – 1608(0603) Multilayer Ceramic Balun Transformer.

Features and Benefits:

2.4 GHz ISM Band Working Frequency
Multilayer LTCC (Low Temperature Co-fired Ceramics) Technology
Miniature Size: 1.6 x 0.8 x 0.7 mm³
Low Insertion Loss reduces power consumption
Low Inband Amplitude and Phase imbalance enable high performance wireless system operation
Enable for DC Biasing of PA or Mixer
Unbalance impedance is upon request

Applications:

2.4 GHz ISM Band RF and Bluetooth, Wireless LAN, HomeRF