MG Chemicals 8329 TCS Liquid Thermal Adhesive, 50 ml
Технически документи
Спецификации
Brand
MG ChemicalsAdhesive Type
Conductive Adhesive
Trade Name
8329 TCS
Application
Industrial, Thermal Management
Material Compatibility
Ceramic, Glass, Metal, Plastic
Product Form
Liquid
Package Type
Can
Package Size
50 ml
Cure Time
20 min
Maximum Operating Temperature
+200°C
Operating Temperature Range
-70 → +200 °C
Odour
Slight
Specific Gravity
2.41
Minimum Operating Temperature
-70°C
Страна на произход
Canada
Детайли за продукта
MG Chemicals 8329 Slow Cure Conductive Adhesives
The MG Chemicals 8329TCS is a slow cure thermal conductive epoxy adhesive with excellent bonding strength and good thermal transfers is used for thermal management of high-powered electronics and LEDs. Once cured, the epoxy adhesive is inert under normal conditions so resists water and salt exposure.
Feature and Benefits
Easy to mix 1:1 mix ratio
Long shelf life
Adheres to most electronic substrates
Behaves like a 1-part adhesive for the length of a work shift
Once cured resists thermal and mechanical shocks in electronic assemblies
Typical Applications
Use as a die attach for electrical and electronics
Heat sink bonding
Use as a high-powered LED adhesive that maximises the lifetime of LEDs by dissipating their heat
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€ 76,30
Всеки (ex VAT)
1
€ 76,30
Всеки (ex VAT)
1
Технически документи
Спецификации
Brand
MG ChemicalsAdhesive Type
Conductive Adhesive
Trade Name
8329 TCS
Application
Industrial, Thermal Management
Material Compatibility
Ceramic, Glass, Metal, Plastic
Product Form
Liquid
Package Type
Can
Package Size
50 ml
Cure Time
20 min
Maximum Operating Temperature
+200°C
Operating Temperature Range
-70 → +200 °C
Odour
Slight
Specific Gravity
2.41
Minimum Operating Temperature
-70°C
Страна на произход
Canada
Детайли за продукта
MG Chemicals 8329 Slow Cure Conductive Adhesives
The MG Chemicals 8329TCS is a slow cure thermal conductive epoxy adhesive with excellent bonding strength and good thermal transfers is used for thermal management of high-powered electronics and LEDs. Once cured, the epoxy adhesive is inert under normal conditions so resists water and salt exposure.
Feature and Benefits
Easy to mix 1:1 mix ratio
Long shelf life
Adheres to most electronic substrates
Behaves like a 1-part adhesive for the length of a work shift
Once cured resists thermal and mechanical shocks in electronic assemblies
Typical Applications
Use as a die attach for electrical and electronics
Heat sink bonding
Use as a high-powered LED adhesive that maximises the lifetime of LEDs by dissipating their heat