Loctite Loctite HF212 97SC DAP Lead Free Solder Paste, 500g Tub
Технически документи
Спецификации
Детайли за продукта
HF 212 Solder Paste
LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications.
LOCTITE HF 212 is a halogen-free, no clean, low voiding Pb-free solder paste
Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC
Suitable for high speed printing up to 150 mm/s
Solderable on challenging surface finishes (CuNiZn and Copper OSP)
Colorless residues for easy post-reflow inspection
RS 832-9750: HF 212 solder paste 97SC DAP
RS 832-9769: HF 212 solder paste 90iSC DAP
RS 832-9762: HF 212 solder paste 90iSC AGS
RS 832-9766: HF 212 solder paste 97SC AGS
RS 832-9775: HF 212 solder paste SAC0307 AGS
Application
Designed for printing, pin-in-paste and enclosed head print capability
Excellent wetting to a broad range of metallization
Compatible with existing halogen-free solutions
Suitable for medium to large board assemblies
Solder Paste - Lead Free
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€ 123,64
Всеки (ex VAT)
1
€ 123,64
Всеки (ex VAT)
1
Купете в насипно състояние
| количество | Единична цена |
|---|---|
| 1 - 9 | € 123,64 |
| 10 - 19 | € 118,70 |
| 20 - 49 | € 114,98 |
| 50+ | € 105,09 |
Технически документи
Спецификации
Детайли за продукта
HF 212 Solder Paste
LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications.
LOCTITE HF 212 is a halogen-free, no clean, low voiding Pb-free solder paste
Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC
Suitable for high speed printing up to 150 mm/s
Solderable on challenging surface finishes (CuNiZn and Copper OSP)
Colorless residues for easy post-reflow inspection
RS 832-9750: HF 212 solder paste 97SC DAP
RS 832-9769: HF 212 solder paste 90iSC DAP
RS 832-9762: HF 212 solder paste 90iSC AGS
RS 832-9766: HF 212 solder paste 97SC AGS
RS 832-9775: HF 212 solder paste SAC0307 AGS
Application
Designed for printing, pin-in-paste and enclosed head print capability
Excellent wetting to a broad range of metallization
Compatible with existing halogen-free solutions
Suitable for medium to large board assemblies