Технически документи
Спецификации
Детайли за продукта
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
Информацията за складовите наличности временно не е налична.
€ 27,53
€ 27,53 Всеки (ex VAT)
1
€ 27,53
€ 27,53 Всеки (ex VAT)
Информацията за складовите наличности временно не е налична.
1
| количество | Единична цена |
|---|---|
| 1 - 4 | € 27,53 |
| 5 - 9 | € 26,43 |
| 10 - 39 | € 25,04 |
| 40+ | € 22,85 |
Технически документи
Спецификации
Детайли за продукта
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
