Технически документи
Спецификации
Детайли за продукта
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
€ 44,37
€ 44,37 Всеки (ex VAT)
1
€ 44,37
€ 44,37 Всеки (ex VAT)
Информацията за складовите наличности временно не е налична.
1
Информацията за складовите наличности временно не е налична.
| количество | Единична цена |
|---|---|
| 1 - 9 | € 44,37 |
| 10 - 19 | € 42,60 |
| 20 - 49 | € 41,27 |
| 50+ | € 37,72 |
Технически документи
Спецификации
Детайли за продукта
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
