Технически документи
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Детайли за продукта
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
€ 9,81
€ 9,81 Всеки (ex VAT)
1
€ 9,81
€ 9,81 Всеки (ex VAT)
Информацията за складовите наличности временно не е налична.
1
Информацията за складовите наличности временно не е налична.
| количество | Единична цена |
|---|---|
| 1 - 9 | € 9,81 |
| 10 - 19 | € 9,43 |
| 20 - 49 | € 9,13 |
| 50+ | € 8,32 |
Технически документи
Спецификации
Детайли за продукта
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
