Технически документи
Спецификации
Brand
BournsTrip Current
2.2A
Voltage Rating
24V
Time to Trip
0.5s
Hold Current
1.1A
Maximum Current
20 A
Length
4.83mm
Height
1.6mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.06Ω
Maximum Resistance
180mΩ
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Operating Temperature Range
-40 → +85 °C
Dimensions
4.83 x 3.41 x 1.6mm
Страна на произход
China
Детайли за продукта
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
Surface Mount Technology
€ 32,71
€ 0,327 Each (Supplied on a Reel) (ex VAT)
Производствен пакет (Ролка)
100
€ 32,71
€ 0,327 Each (Supplied on a Reel) (ex VAT)
Производствен пакет (Ролка)
100
Информацията за складовите наличности временно не е налична.
Моля, проверете отново по-късно.
количество | Единична цена | Per Ролка |
---|---|---|
100 - 1490 | € 0,327 | € 3,27 |
1500 - 2990 | € 0,319 | € 3,19 |
3000 - 4490 | € 0,311 | € 3,11 |
4500+ | € 0,303 | € 3,03 |
Технически документи
Спецификации
Brand
BournsTrip Current
2.2A
Voltage Rating
24V
Time to Trip
0.5s
Hold Current
1.1A
Maximum Current
20 A
Length
4.83mm
Height
1.6mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.06Ω
Maximum Resistance
180mΩ
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Operating Temperature Range
-40 → +85 °C
Dimensions
4.83 x 3.41 x 1.6mm
Страна на произход
China
Детайли за продукта
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly