Bourns 0.5A Resettable Fuse, 15V

Технически документи
Спецификации
Brand
BournsTrip Current
1A
Voltage Rating
15V
Time to Trip
0.15s
Hold Current
0.5A
Maximum Current
100 A
Length
4.73mm
Height
0.85mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.15Ω
Maximum Resistance
1Ω
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+85°C
Package Size
1812
Operating Temperature Range
-40 → +85 °C
Dimensions
4.73 x 3.41 x 0.85mm
Детайли за продукта
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
Surface Mount Technology
€ 2,38
€ 0,238 Each (In a Pack of 10) (ex VAT)
Стандарт
10
€ 2,38
€ 0,238 Each (In a Pack of 10) (ex VAT)
Информацията за складовите наличности временно не е налична.
Стандарт
10
Информацията за складовите наличности временно не е налична.
| количество | Единична цена | Per Опаковка |
|---|---|---|
| 10 - 90 | € 0,238 | € 2,38 |
| 100 - 490 | € 0,231 | € 2,31 |
| 500 - 1490 | € 0,225 | € 2,25 |
| 1500 - 2490 | € 0,219 | € 2,19 |
| 2500+ | € 0,213 | € 2,12 |
Технически документи
Спецификации
Brand
BournsTrip Current
1A
Voltage Rating
15V
Time to Trip
0.15s
Hold Current
0.5A
Maximum Current
100 A
Length
4.73mm
Height
0.85mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.15Ω
Maximum Resistance
1Ω
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+85°C
Package Size
1812
Operating Temperature Range
-40 → +85 °C
Dimensions
4.73 x 3.41 x 0.85mm
Детайли за продукта
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly