Bourns 0.3A Resettable Fuse, 30V

Технически документи
Спецификации
Brand
BournsTrip Current
0.6A
Voltage Rating
30V
Time to Trip
0.1s
Hold Current
0.3A
Maximum Current
10 A
Length
4.73mm
Height
1.1mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.3Ω
Maximum Resistance
3Ω
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Series
MF-MSMF
Operating Temperature Range
-40 → +85 °C
Dimensions
4.73 x 3.41 x 1.1mm
Детайли за продукта
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
Surface Mount Technology
Информацията за складовите наличности временно не е налична.
€ 2,67
€ 0,267 Each (In a Pack of 10) (ex VAT)
Стандарт
10
€ 2,67
€ 0,267 Each (In a Pack of 10) (ex VAT)
Информацията за складовите наличности временно не е налична.
Стандарт
10
| количество | Единична цена | Per Опаковка |
|---|---|---|
| 10 - 90 | € 0,267 | € 2,67 |
| 100 - 490 | € 0,259 | € 2,59 |
| 500 - 1490 | € 0,252 | € 2,52 |
| 1500 - 2490 | € 0,245 | € 2,45 |
| 2500+ | € 0,239 | € 2,40 |
Технически документи
Спецификации
Brand
BournsTrip Current
0.6A
Voltage Rating
30V
Time to Trip
0.1s
Hold Current
0.3A
Maximum Current
10 A
Length
4.73mm
Height
1.1mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.3Ω
Maximum Resistance
3Ω
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Series
MF-MSMF
Operating Temperature Range
-40 → +85 °C
Dimensions
4.73 x 3.41 x 1.1mm
Детайли за продукта
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly