Технически документи
Спецификации
Brand
BournsTrip Current
0.3A
Voltage Rating
60V
Time to Trip
1.5s
Hold Current
0.1A
Maximum Current
40 A
Length
4.73mm
Height
1.1mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.7Ω
Maximum Resistance
15Ω
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Series
MF-MSMF
Operating Temperature Range
-40 → +85 °C
Dimensions
4.73 x 3.41 x 1.1mm
Детайли за продукта
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
Surface Mount Technology
€ 25,80
€ 0,258 Each (Supplied on a Reel) (ex VAT)
Производствен пакет (Ролка)
100
€ 25,80
€ 0,258 Each (Supplied on a Reel) (ex VAT)
Информацията за складовите наличности временно не е налична.
Производствен пакет (Ролка)
100
Информацията за складовите наличности временно не е налична.
| количество | Единична цена | Per Ролка |
|---|---|---|
| 100 - 490 | € 0,258 | € 2,58 |
| 500 - 1490 | € 0,251 | € 2,51 |
| 1500 - 2490 | € 0,244 | € 2,44 |
| 2500+ | € 0,238 | € 2,38 |
Технически документи
Спецификации
Brand
BournsTrip Current
0.3A
Voltage Rating
60V
Time to Trip
1.5s
Hold Current
0.1A
Maximum Current
40 A
Length
4.73mm
Height
1.1mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.7Ω
Maximum Resistance
15Ω
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Series
MF-MSMF
Operating Temperature Range
-40 → +85 °C
Dimensions
4.73 x 3.41 x 1.1mm
Детайли за продукта
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
