Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Технически документи
Спецификации
Brand
BergquistThickness
0.001in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+150°C
Material Trade Name
Hi-Flow 650P
Operating Temperature Range
-40 → +150 °C
Страна на произход
United States
Детайли за продукта
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.
Thermal Impedance: 0.20°C-in2/W (@25 psi)
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad
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Моля, проверете отново по-късно.
€ 2,678
Each (In a Bag of 50) (ex VAT)
50
€ 2,678
Each (In a Bag of 50) (ex VAT)
50
Купете в насипно състояние
количество | Единична цена | Per Чувал |
---|---|---|
50 - 450 | € 2,678 | € 133,91 |
500 - 1200 | € 2,586 | € 129,29 |
1250 - 2450 | € 2,499 | € 124,96 |
2500 - 4950 | € 2,419 | € 120,93 |
5000+ | € 2,344 | € 117,18 |
Технически документи
Спецификации
Brand
BergquistThickness
0.001in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+150°C
Material Trade Name
Hi-Flow 650P
Operating Temperature Range
-40 → +150 °C
Страна на произход
United States
Детайли за продукта
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.
Thermal Impedance: 0.20°C-in2/W (@25 psi)
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad