Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

Номер на артикул на RS: 127-041Марка: Bergquist№ по каталога на производителя: HF225FAC-0.004-AC-1112
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Технически документи

Спецификации

Brand

Bergquist

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Страна на произход

United States

Детайли за продукта

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

Информацията за складовите наличности временно не е налична.

Моля, проверете отново по-късно.

Информацията за складовите наличности временно не е налична.

P.O.A.

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

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P.O.A.

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
Информацията за складовите наличности временно не е налична.

1

Предлагат се на бройка по 1
1P.O.A.
2P.O.A.
3P.O.A.
4P.O.A.
5P.O.A.
6P.O.A.
7P.O.A.
8P.O.A.
9P.O.A.
10P.O.A.
11P.O.A.
12P.O.A.
13P.O.A.
14P.O.A.
15P.O.A.

Технически документи

Спецификации

Brand

Bergquist

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Страна на произход

United States

Детайли за продукта

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm