Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount

Номер на артикул на RS: 903-3144Марка: ABL Components№ по каталога на производителя: 180AB1000B
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Технически документи

Спецификации

For Use With

Universal Rectangular Alu

Length

100mm

Width

215mm

Height

77mm

Dimensions

100 x 215 x 77mm

Thermal Resistance

0.14°C/W

Mounting

PCB Mount

Series

100

Material

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finish

Anodized

Страна на произход

United Kingdom

Детайли за продукта

Heat Sink 180AB Series, 215mm Wide x 77mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.

Информацията за складовите наличности временно не е налична.

P.O.A.

Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount

P.O.A.

Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount
Информацията за складовите наличности временно не е налична.

Информацията за складовите наличности временно не е налична.

Моля, проверете отново по-късно.

Технически документи

Спецификации

For Use With

Universal Rectangular Alu

Length

100mm

Width

215mm

Height

77mm

Dimensions

100 x 215 x 77mm

Thermal Resistance

0.14°C/W

Mounting

PCB Mount

Series

100

Material

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finish

Anodized

Страна на произход

United Kingdom

Детайли за продукта

Heat Sink 180AB Series, 215mm Wide x 77mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.