Heatsink, Universal Square Alu, 23.4K/W, 23 x 23 x 18mm, Adhesive Foil

Номер на артикул на RS: 104-036Марка: AAVID THERMALLOY№ по каталога на производителя: 306216
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Технически документи

Спецификации

Brand

AAVID THERMALLOY

For Use With

Universal Square Alu

Length

23mm

Width

23mm

Height

18mm

Dimensions

23 x 23 x 18mm

Thermal Resistance

23.4K/W

Mounting

Adhesive Foil

Colour

Black

Material

Aluminium

Package Type

BGA

Детайли за продукта

BGA Heatsink, Tape mounting

A range of BGA heatsinks with thermally conductive adhesive tape mounting.

Tape mounting saves board space by eliminating mounting holes
Convenient peel and stick assembly is quick and clean
Pin Fin array allows omni-directional airflow to maximize heat dissipation

BGA Heatsinks

Информацията за складовите наличности временно не е налична.

Моля, проверете отново по-късно.

Информацията за складовите наличности временно не е налична.

€ 1,94

Всеки (ex VAT)

Heatsink, Universal Square Alu, 23.4K/W, 23 x 23 x 18mm, Adhesive Foil

1

Предлагат се на бройка по 1
1€ 1,94
2€ 3,88
3€ 5,81
4€ 7,75
5€ 9,69
6€ 11,63
7€ 13,57
8€ 15,50
9€ 17,44
10€ 17,75
11€ 19,52
12€ 21,30
13€ 23,07
14€ 24,84
15€ 26,62

€ 1,94

Всеки (ex VAT)

Heatsink, Universal Square Alu, 23.4K/W, 23 x 23 x 18mm, Adhesive Foil
Информацията за складовите наличности временно не е налична.

1

Предлагат се на бройка по 1
1€ 1,94
2€ 3,88
3€ 5,81
4€ 7,75
5€ 9,69
6€ 11,63
7€ 13,57
8€ 15,50
9€ 17,44
10€ 17,75
11€ 19,52
12€ 21,30
13€ 23,07
14€ 24,84
15€ 26,62

Купете в насипно състояние

количествоЕдинична цена
1 - 9€ 1,94
10 - 24€ 1,77
25 - 49€ 1,70
50 - 99€ 1,65
100+€ 1,55

Технически документи

Спецификации

Brand

AAVID THERMALLOY

For Use With

Universal Square Alu

Length

23mm

Width

23mm

Height

18mm

Dimensions

23 x 23 x 18mm

Thermal Resistance

23.4K/W

Mounting

Adhesive Foil

Colour

Black

Material

Aluminium

Package Type

BGA

Детайли за продукта

BGA Heatsink, Tape mounting

A range of BGA heatsinks with thermally conductive adhesive tape mounting.

Tape mounting saves board space by eliminating mounting holes
Convenient peel and stick assembly is quick and clean
Pin Fin array allows omni-directional airflow to maximize heat dissipation

BGA Heatsinks