Vishay 220μF Surface Mount Polymer Capacitor, 6.3V dc
Технически документи
Спецификации
Brand
VishayTechnology
Polymer
Capacitance
220µF
Dielectric Material Family
Tantalum
Voltage
6.3V dc
Mounting Type
Surface Mount
Package/Case
3528-21
Equivalent Series Resistance
70mΩ
Tolerance
±20%
Length
3.5mm
Depth
2.8mm
Height
1.9mm
Maximum Operating Temperature
+105°C
Dimensions
3.5 x 2.8 x 1.9mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
138.6 μA
Детайли за продукта
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
Информацията за складовите наличности временно не е налична.
Моля, проверете отново по-късно.
€ 0,349
Each (In a Pack of 10) (ex VAT)
Стандарт
10
€ 0,349
Each (In a Pack of 10) (ex VAT)
Стандарт
10
Технически документи
Спецификации
Brand
VishayTechnology
Polymer
Capacitance
220µF
Dielectric Material Family
Tantalum
Voltage
6.3V dc
Mounting Type
Surface Mount
Package/Case
3528-21
Equivalent Series Resistance
70mΩ
Tolerance
±20%
Length
3.5mm
Depth
2.8mm
Height
1.9mm
Maximum Operating Temperature
+105°C
Dimensions
3.5 x 2.8 x 1.9mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
138.6 μA
Детайли за продукта
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets