Fibox ARCA Series Polycarbonate Wall Box, IP66, 300 mm x 200 mm x 150mm

Номер на артикул на RS: 798-2000Марка: Fibox№ по каталога на производителя: ARCA 302015IMPA: 0
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Технически документи

Спецификации

Transparent Door

No

Fixing Kit

No

Gland Plate

No

External Mounting Type

Bracket, Holes Outside Gasket Area

Chassis Plate

Yes

Static Load Capacity

160daN

Internal Mounting Type

Panel

Door Lock Type

Key

IP Rating

IP66

Series

ARCA

Body Material

Polycarbonate

Colour

Grey

External Depth

150mm

External Width

200 mm

External Height

300 mm

Brand

Fibox

Страна на произход

Finland

Детайли за продукта

Savbit® solder

Solder wire which contains a low percentage of copper to increase the life of soldering iron tips.
It also enables soldering of fine copper wire by overcoming the problem of ordinary tin/lead solders dissolving copper, which often leads to breakage.
Composition based on a tin, lead and copper alloy and on 5-core 362 non-corrosive no-clean flux.
Melting temperature: solid 183 °C, liquid 215 °C.

Информацията за складовите наличности временно не е налична.

Моля, проверете отново по-късно.

Информацията за складовите наличности временно не е налична.

€ 83,42

Всеки (ex VAT)

Fibox ARCA Series Polycarbonate Wall Box, IP66, 300 mm x 200 mm x 150mm

€ 83,42

Всеки (ex VAT)

Fibox ARCA Series Polycarbonate Wall Box, IP66, 300 mm x 200 mm x 150mm
Информацията за складовите наличности временно не е налична.

Купете в насипно състояние

количествоЕдинична цена
1 - 4€ 83,42
5+€ 79,19

Технически документи

Спецификации

Transparent Door

No

Fixing Kit

No

Gland Plate

No

External Mounting Type

Bracket, Holes Outside Gasket Area

Chassis Plate

Yes

Static Load Capacity

160daN

Internal Mounting Type

Panel

Door Lock Type

Key

IP Rating

IP66

Series

ARCA

Body Material

Polycarbonate

Colour

Grey

External Depth

150mm

External Width

200 mm

External Height

300 mm

Brand

Fibox

Страна на произход

Finland

Детайли за продукта

Savbit® solder

Solder wire which contains a low percentage of copper to increase the life of soldering iron tips.
It also enables soldering of fine copper wire by overcoming the problem of ordinary tin/lead solders dissolving copper, which often leads to breakage.
Composition based on a tin, lead and copper alloy and on 5-core 362 non-corrosive no-clean flux.
Melting temperature: solid 183 °C, liquid 215 °C.