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Heatsink, D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors, 15°C/W, 25.91 x 14.99 x 9.52mm,

Номер на артикул на RS: 880-6008Марка: AAVID THERMALLOY№ по каталога на производителя: 7106DG
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Технически документи

Спецификации

Brand

AAVID THERMALLOY

For Use With

D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors

Length

25.91mm

Width

14.99mm

Height

9.52mm

Dimensions

25.91 x 14.99 x 9.52mm

Thermal Resistance

15°C/W

Mounting

Horizontal

Series

7106

Package Type

SMT

Material

Aluminium

Application

Through Hole Discrete Semiconductors

Finish

Tin Plated

Special Features

The Device and the Heat Sink are Soldered Directly to a Modified Drain Pad Creating a Thermal Transfer Path from Package Tab to the Heat Sink

Страна на произход

China

Информацията за складовите наличности временно не е налична.

Моля, проверете отново по-късно.

Информацията за складовите наличности временно не е налична.

P.O.A.

Heatsink, D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors, 15°C/W, 25.91 x 14.99 x 9.52mm,

50

Предлагат се на бройка по 1
50P.O.A.
100P.O.A.
150P.O.A.
200P.O.A.
250P.O.A.
300P.O.A.
350P.O.A.
400P.O.A.
450P.O.A.
500P.O.A.
550P.O.A.
600P.O.A.
650P.O.A.
700P.O.A.
750P.O.A.

P.O.A.

Heatsink, D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors, 15°C/W, 25.91 x 14.99 x 9.52mm,
Информацията за складовите наличности временно не е налична.

50

Предлагат се на бройка по 1
50P.O.A.
100P.O.A.
150P.O.A.
200P.O.A.
250P.O.A.
300P.O.A.
350P.O.A.
400P.O.A.
450P.O.A.
500P.O.A.
550P.O.A.
600P.O.A.
650P.O.A.
700P.O.A.
750P.O.A.

Технически документи

Спецификации

Brand

AAVID THERMALLOY

For Use With

D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors

Length

25.91mm

Width

14.99mm

Height

9.52mm

Dimensions

25.91 x 14.99 x 9.52mm

Thermal Resistance

15°C/W

Mounting

Horizontal

Series

7106

Package Type

SMT

Material

Aluminium

Application

Through Hole Discrete Semiconductors

Finish

Tin Plated

Special Features

The Device and the Heat Sink are Soldered Directly to a Modified Drain Pad Creating a Thermal Transfer Path from Package Tab to the Heat Sink

Страна на произход

China