Fischer Elektronik Heatsink, Universal Square Alu, 13.5K/W, 27 x 27 x 22mm, Adhesive Foil, Conductive Foil
Технически документи
Спецификации
Brand
Fischer ElektronikFor Use With
Universal Square Alu
Length
27mm
Width
27mm
Height
22mm
Dimensions
27 x 27 x 22mm
Thermal Resistance
13.5K/W
Mounting
Adhesive Foil, Conductive Foil
Colour
Black
Package Type
BGA
Material
Aluminium
Страна на произход
Germany
Детайли за продукта
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
€ 11,67
€ 11,67 Всеки (ex VAT)
1
€ 11,67
€ 11,67 Всеки (ex VAT)
1
Информацията за складовите наличности временно не е налична.
Моля, проверете отново по-късно.
| количество | Единична цена |
|---|---|
| 1 - 9 | € 11,67 |
| 10 - 24 | € 10,74 |
| 25 - 49 | € 10,26 |
| 50 - 99 | € 9,91 |
| 100+ | € 9,10 |
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Технически документи
Спецификации
Brand
Fischer ElektronikFor Use With
Universal Square Alu
Length
27mm
Width
27mm
Height
22mm
Dimensions
27 x 27 x 22mm
Thermal Resistance
13.5K/W
Mounting
Adhesive Foil, Conductive Foil
Colour
Black
Package Type
BGA
Material
Aluminium
Страна на произход
Germany
Детайли за продукта
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products