Технически документи
Спецификации
Brand
JSTSeries
PA
Pitch
2.0mm
Number Of Contacts
16
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Copper Alloy
Current Rating
3.0A
Voltage Rating
250.0 V
Страна на произход
Japan
Детайли за продукта
Optocoupler, Intelligent Power Module (IPM) Interface, Avago Technologies
Avago Technologies optocouplers for IPM (Intelligent Power Module) interface exhibit short propagation delay, fast IGBT switching, high common mode transient rejection and wide operating temperature range.
Avago Technologies R2Coupler™ isolation products provide the reinforced insulation and reliability needed for critical automotive and high temperature applications.
€ 21,61
€ 2,161 Each (In a Pack of 10) (ex VAT)
10
€ 21,61
€ 2,161 Each (In a Pack of 10) (ex VAT)
10
Информацията за складовите наличности временно не е налична.
Моля, проверете отново по-късно.
количество | Единична цена | Per Опаковка |
---|---|---|
10 - 240 | € 2,161 | € 21,61 |
250 - 990 | € 2,043 | € 20,43 |
1000 - 1490 | € 1,965 | € 19,65 |
1500 - 2490 | € 1,871 | € 18,71 |
2500+ | € 1,789 | € 17,89 |
Технически документи
Спецификации
Brand
JSTSeries
PA
Pitch
2.0mm
Number Of Contacts
16
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Copper Alloy
Current Rating
3.0A
Voltage Rating
250.0 V
Страна на произход
Japan
Детайли за продукта
Optocoupler, Intelligent Power Module (IPM) Interface, Avago Technologies
Avago Technologies optocouplers for IPM (Intelligent Power Module) interface exhibit short propagation delay, fast IGBT switching, high common mode transient rejection and wide operating temperature range.
Avago Technologies R2Coupler™ isolation products provide the reinforced insulation and reliability needed for critical automotive and high temperature applications.