Технически документи
Спецификации
Brand
TDKPackage Type
0603 (1608M)
Impedance at 100 MHz
600Ω
Current Rating
500mA
Type
Chip Bead
Dimensions
1.6 x 0.8 x 0.6mm
Length
1.6mm
Depth
0.8mm
Maximum DC Resistance
0.40Ω
Height
0.6mm
Material
B
Application
Signal Line
Series
MMZ
Страна на произход
Japan
Детайли за продукта
TDK 0603 MMZ1608 Series Multilayer Chip Bead Inductors
This is a multilayered chip bead product magnetically shielded, allowing high density mounting
The internal conductor design reduces floating capacity between conductors, which in turn has contributed to a dramatic improvement in high frequency characteristics
This product is able to expand and reinforce the EMI suppression into the GHz range
Applications include removal of signal line noises of cellular phones, portable audio players, various modules, DSCs, portable game machines, etc.
€ 10,98
€ 0,022 Each (Supplied on a Reel) (ex VAT)
Производствен пакет (Ролка)
500
€ 10,98
€ 0,022 Each (Supplied on a Reel) (ex VAT)
Информацията за складовите наличности временно не е налична.
Производствен пакет (Ролка)
500
Информацията за складовите наличности временно не е налична.
количество | Единична цена | Per Ролка |
---|---|---|
500 - 900 | € 0,022 | € 2,20 |
1000 - 1900 | € 0,018 | € 1,85 |
2000 - 4900 | € 0,016 | € 1,62 |
5000+ | € 0,014 | € 1,39 |
Технически документи
Спецификации
Brand
TDKPackage Type
0603 (1608M)
Impedance at 100 MHz
600Ω
Current Rating
500mA
Type
Chip Bead
Dimensions
1.6 x 0.8 x 0.6mm
Length
1.6mm
Depth
0.8mm
Maximum DC Resistance
0.40Ω
Height
0.6mm
Material
B
Application
Signal Line
Series
MMZ
Страна на произход
Japan
Детайли за продукта
TDK 0603 MMZ1608 Series Multilayer Chip Bead Inductors
This is a multilayered chip bead product magnetically shielded, allowing high density mounting
The internal conductor design reduces floating capacity between conductors, which in turn has contributed to a dramatic improvement in high frequency characteristics
This product is able to expand and reinforce the EMI suppression into the GHz range
Applications include removal of signal line noises of cellular phones, portable audio players, various modules, DSCs, portable game machines, etc.