Технически документи
Спецификации
Brand
MolexSeries
PMC Mezzanine
Pitch
1.0mm
Number Of Contacts
64
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Gold
Contact Material
Phosphor Bronze
Series Number
71436
Current Rating
1A
Voltage Rating
100.0 V
Страна на произход
United States
Детайли за продукта
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component
€ 7,32
€ 7,32 Всеки (ex VAT)
Стандарт
1
€ 7,32
€ 7,32 Всеки (ex VAT)
Информацията за складовите наличности временно не е налична.
Стандарт
1
Информацията за складовите наличности временно не е налична.
количество | Единична цена |
---|---|
1 - 19 | € 7,32 |
20 - 74 | € 6,41 |
75 - 299 | € 6,17 |
300 - 599 | € 6,02 |
600+ | € 5,86 |
Технически документи
Спецификации
Brand
MolexSeries
PMC Mezzanine
Pitch
1.0mm
Number Of Contacts
64
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Gold
Contact Material
Phosphor Bronze
Series Number
71436
Current Rating
1A
Voltage Rating
100.0 V
Страна на произход
United States
Детайли за продукта
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component