Технически документи
Спецификации
Brand
VishayTechnology
Polymer
Capacitance
100µF
Dielectric Material Family
Tantalum
Voltage
6.3V dc
Mounting Type
Surface Mount
Package/Case
3216-18
Equivalent Series Resistance
70mΩ
Tolerance
±20%
Length
3.2mm
Depth
1.6mm
Height
1.6mm
Maximum Operating Temperature
+105°C
Dimensions
3.2 x 1.6 x 1.6mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
63 μA
Детайли за продукта
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
Информацията за складовите наличности временно не е налична.
Моля, проверете отново по-късно.
€ 0,351
Each (On a Reel of 2000) (ex VAT)
2000
€ 0,351
Each (On a Reel of 2000) (ex VAT)
2000
Купете в насипно състояние
количество | Единична цена | Per Ролка |
---|---|---|
2000 - 2000 | € 0,351 | € 701,70 |
4000+ | € 0,34 | € 680,65 |
Технически документи
Спецификации
Brand
VishayTechnology
Polymer
Capacitance
100µF
Dielectric Material Family
Tantalum
Voltage
6.3V dc
Mounting Type
Surface Mount
Package/Case
3216-18
Equivalent Series Resistance
70mΩ
Tolerance
±20%
Length
3.2mm
Depth
1.6mm
Height
1.6mm
Maximum Operating Temperature
+105°C
Dimensions
3.2 x 1.6 x 1.6mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
63 μA
Детайли за продукта
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets