Технически документи
Спецификации
Brand
TDKPackage Type
0603 (1608M)
Impedance at 100 MHz
300Ω
Current Rating
300mA
Type
Chip Bead
Dimensions
1.6 x 0.8 x 0.8mm
Length
1.6mm
Depth
0.8mm
Height
0.8mm
Maximum DC Resistance
0.70Ω
Material
D
Series
MMZ
Application
Signal Line
Детайли за продукта
Chip bead 0603 MMZ series
This is a multilayered chip bead product which is magnetically shielded, allowing high density mounting
Reduced floating capacity between conductors has contributed to a dramatic improvement in high frequency characteristics
The EMI suppression provided extends into the GHz range
Application include removal of signal line noises of cellular phones, portable audio players, etc
Информацията за складовите наличности временно не е налична.
Моля, проверете отново по-късно.
P.O.A.
100
P.O.A.
100
Технически документи
Спецификации
Brand
TDKPackage Type
0603 (1608M)
Impedance at 100 MHz
300Ω
Current Rating
300mA
Type
Chip Bead
Dimensions
1.6 x 0.8 x 0.8mm
Length
1.6mm
Depth
0.8mm
Height
0.8mm
Maximum DC Resistance
0.70Ω
Material
D
Series
MMZ
Application
Signal Line
Детайли за продукта
Chip bead 0603 MMZ series
This is a multilayered chip bead product which is magnetically shielded, allowing high density mounting
Reduced floating capacity between conductors has contributed to a dramatic improvement in high frequency characteristics
The EMI suppression provided extends into the GHz range
Application include removal of signal line noises of cellular phones, portable audio players, etc