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Sunhayato Double Sided Matrix Board FR4 0.75mm Holes, 1.27 x 1.27mm Pitch, 160 x 115 x 1.6mm

Номер на артикул на RS: 391-7175Марка: Sunhayato№ по каталога на производителя: ICB-09
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Технически документи

Спецификации

Number of Sides

2

Hole Pitch

1.27 x 1.27mm

Dimensions

160 x 115 x 1.6mm

Length

160mm

Width

115mm

Thickness

1.6mm

Base Material

Epoxy Glass Fabric Laminate

Hole Diameter

0.75mm

FR Material Grade

FR4

Страна на произход

Japan

Детайли за продукта

Universal board for unique ICs

Supports combinations of 1.27, 1.27 houndstooth and 1.778 ´ 2.54
Suitable for installing ZIP ICs and multi-purpose use
Materials / thickness: glass epoxy (FR-4) 1.6 t
ICB-04 board thickness: 1.2 t

Optocoupler, Intelligent Power Module (IPM) Interface, Avago Technologies

Avago Technologies optocouplers for IPM (Intelligent Power Module) interface exhibit short propagation delay, fast IGBT switching, high common mode transient rejection and wide operating temperature range.
Avago Technologies R2Coupler™ isolation products provide the reinforced insulation and reliability needed for critical automotive and high temperature applications.

Информацията за складовите наличности временно не е налична.

€ 41,76

€ 41,76 Всеки (ex VAT)

Sunhayato Double Sided Matrix Board FR4 0.75mm Holes, 1.27 x 1.27mm Pitch, 160 x 115 x 1.6mm

€ 41,76

€ 41,76 Всеки (ex VAT)

Sunhayato Double Sided Matrix Board FR4 0.75mm Holes, 1.27 x 1.27mm Pitch, 160 x 115 x 1.6mm
Информацията за складовите наличности временно не е налична.

Информацията за складовите наличности временно не е налична.

Моля, проверете отново по-късно.

Технически документи

Спецификации

Number of Sides

2

Hole Pitch

1.27 x 1.27mm

Dimensions

160 x 115 x 1.6mm

Length

160mm

Width

115mm

Thickness

1.6mm

Base Material

Epoxy Glass Fabric Laminate

Hole Diameter

0.75mm

FR Material Grade

FR4

Страна на произход

Japan

Детайли за продукта

Universal board for unique ICs

Supports combinations of 1.27, 1.27 houndstooth and 1.778 ´ 2.54
Suitable for installing ZIP ICs and multi-purpose use
Materials / thickness: glass epoxy (FR-4) 1.6 t
ICB-04 board thickness: 1.2 t

Optocoupler, Intelligent Power Module (IPM) Interface, Avago Technologies

Avago Technologies optocouplers for IPM (Intelligent Power Module) interface exhibit short propagation delay, fast IGBT switching, high common mode transient rejection and wide operating temperature range.
Avago Technologies R2Coupler™ isolation products provide the reinforced insulation and reliability needed for critical automotive and high temperature applications.