Гнезда за памет
Гнездата за памет са част от печатни платки, предназначени за използване в персонални компютри, сървъри и работни станции. Модулът се монтира на платката с помощта на модулно гнездо. DIMM модулите са преобладаващата форма на памет, използвана в компютрите.
Какво представляват DIMM?
DIMM са модули памет, които са съставени от серия от интегрални схеми с динамична памет с произволен...
Показване на [страница] от [общо] продукти
Amphenol ICC
SODIMM
-
DIMM Socket
Right Angle
-
0.5A
-
Copper Alloy
-
Gold
-
200
-
0.6mm
-
Surface Mount
LCP
-
-
DDR
Surface Mount
-40°C
Yes
-
-
85°C
-
30mΩ
UL 94V-0
-
-
-
-
-
1.8V
DDR SODIMM
Amphenol ICC
SODIMM
-
DIMM Socket
Straight
-
-
-
Copper Alloy
-
Gold
-
200
-
0.6mm
-
Surface Mount
LCP
-
-
DDR2
Surface Mount
-55°C
Yes
3mm
-
85°C
-
-
UL 94V-0
-
-
-
-
-
50V
10116658
Amphenol ICC
DDR3
-
DIMM Socket
Vertical
-
-
-
Copper Alloy
-
Gold
-
240
-
1mm
-
Board
High Temperature Thermoplastic
-
-
DDR3
Through Hole
-55°C
Yes
5.7mm
-
85°C
-
-
RoHS Compliant
-
-
-
-
-
1.3V
10078239
Amphenol ICC
DDR3
-
DIMM Socket
Vertical
-
-
-
Copper Alloy
-
Gold
-
240
-
1mm
-
Through Hole
High Temperature Thermoplastic
-
-
DDR3
Through Hole
-55°C
Yes
3mm
-
85°C
-
-
JEDEC MO-269
-
-
-
-
-
1.5V
10081530
Amphenol ICC
DDR3
-
DIMM Socket
Vertical
-
-
-
Copper Alloy
-
Gold
-
240
-
1mm
-
Through Hole
High Temperature Thermoplastic
-
-
DDR3
Through Hole
-55°C
Yes
3mm
-
85°C
-
-
JEDEC MO-269
-
-
-
-
-
1.5V
10081530
Molex
MiniDIMM
-
Socket
Right Angle
Latched
1A
-
Brass Phosphor Bronze
-
Gold
-
244
-
0.6mm
-
Surface Mount
High Temperature Thermoplastic
-
-
-
Surface Mount
-55°C
Yes
-
-
85°C
-
-
CSA LR19980
-
-
-
-
-
30V
78001
Molex
MiniDIMM
-
Socket
Straight
Latched
1A
-
Copper Alloy
-
Gold
-
244
-
0.60mm
-
Surface Mount
High Temperature Thermoplastic
-
-
DDR2
Surface Mount
-10°C
Yes
-
-
85°C
-
-
UL E29179
-
-
-
-
-
30V
78035
Molex
DDR3
-
Socket
Straight
Latched
1A
-
Copper Alloy
-
Gold
-
244
-
0.60mm
-
Surface Mount
High Temperature Thermoplastic
-
-
DDR3
Surface Mount
-55°C
Yes
-
-
85°C
-
-
UL E29179
-
-
-
-
-
30V
78035
Molex
DIMM
-
Socket
Vertical
Latched
0.75A
-
Copper Alloy
-
Gold
-
288
-
0.85mm
-
Press Fit
High Performance Polyamide (Nylon) Resins
-
-
DDR4
Press Fit
-55°C
Yes
1.58mm
-
85°C
-
-
CSA LR19980
-
-
-
-
-
29V
78731
Molex
DIMM
-
Socket
Vertical
Latched
0.75A
-
Copper Alloy
-
Gold over Tin
-
288
-
0.85mm
-
Through Hole
Nylon
-
-
DDR4
Through Hole
-55°C
Yes
1.58mm
-
85°C
-
-
CSA LR19980
-
-
-
-
-
29V
78726
Molex
DIMM
-
Socket
Vertical
Latched
0.75A
-
Copper Alloy
-
Gold
-
288
-
0.85mm
-
Through Hole
Nylon
-
-
DDR4
Through Hole
-55°C
Yes
1.58mm
-
85°C
-
-
CSA LR19980
-
-
-
-
-
29V
78726
Molex
DIMM
-
Socket
Vertical
Latched
0.75A
-
Copper Alloy
-
Gold
-
288
-
0.85mm
-
Through Hole
Nylon
-
-
DDR4
Through Hole
-55°C
Yes
1.58mm
-
85°C
-
-
CSA LR19980
-
-
-
-
-
29V
78726
Molex
DIMM
-
Socket
Vertical
Latched
0.75A
-
Copper Alloy
-
Gold
-
288
-
0.85mm
-
Through Hole
Nylon
-
-
DDR4
Through Hole
-55°C
Yes
1.58mm
-
85°C
-
-
CSA LR19980
-
-
-
-
-
29V
78726
Molex
DIMM
-
Socket
25°
Latched
1A
-
Copper Alloy
-
Gold
-
240
-
1mm
-
Through Hole
High Temperature Thermoplastic
-
-
DDR3
Through Hole
-55°C
Yes
-
-
85°C
-
-
IEC-62474
-
-
-
-
-
30V
78373
Molex
DIMM
-
Socket
Vertical
-
1A
-
Copper Alloy
-
Gold
-
240
-
1mm
-
Through Hole
Nylon
-
-
DDR3
Pin
-55°C
Yes
-
-
85°C
-
-
RoHS Compliant
-
-
-
-
-
30V
78315
Molex
DIMM
-
Socket
Vertical
Latched
1A
-
Copper Alloy
-
Gold
-
240
-
1mm
-
Through Hole
Nylon
-
-
DDR3
Press Fit
-55°C
Yes
-
-
85°C
-
-
UL E29179
-
-
-
-
-
30V
78315
TE Connectivity
Memory Card
-
DIMM Socket
Right Angle
-
0.5A
-
Copper Alloy
-
Gold
-
260
-
0.5mm
-
Board
High Temperature Thermoplastic
-
-
DDR4
Surface Mount
-55°C
Yes
8.2mm
-
85°C
-
10mΩ
UL 94V-0
-
-
-
-
-
1.2V
DDR4 SODIMM
TE Connectivity
Memory Card
-
DIMM Socket
Right Angle
-
0.5A
-
Copper Alloy
-
Gold
-
260
-
0.5mm
-
Board
High Temperature Thermoplastic
-
-
DDR4
Surface Mount
-55°C
Yes
8.2mm
-
85°C
-
50mΩ
UL 94V-0
-
-
-
-
-
1.2V
DDR4 SODIMM
TE Connectivity
Memory Card
-
DIMM Socket
Right Angle
-
0.5A
-
Copper Alloy
-
Gold
-
260
-
0.5mm
-
Board
High Temperature Thermoplastic
-
-
DDR4
Surface Mount
-55°C
Yes
8.2mm
-
85°C
-
50mΩ
UL 94V-0
-
-
-
-
-
1.2V
DDR4 SODIMM
TE Connectivity
Memory Card
-
Socket
Straight
Cam-In
0.5A
-
Copper Alloy
-
Gold Flash
-
200
-
0.6mm
-
Board
High Temperature Thermoplastic
-
-
DDR
Surface Mount
-55°C
-
6.2mm
-
85°C
-
-
UL 94V-0
-
-
-
-
-
2.5V
DDR2 SO DIMM
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