Гнезда за памет
Гнездата за памет са част от печатни платки, предназначени за използване в персонални компютри, сървъри и работни станции. Модулът се монтира на платката с помощта на модулно гнездо. DIMM модулите са преобладаващата форма на памет, използвана в компютрите.
Какво представляват DIMM?
DIMM са модули памет, които са съставени от серия от интегрални схеми с динамична памет с произволен...
Показване на [страница] от [общо] продукти
Amphenol ICC
-
DIMM Socket
SODIMM
-
Right Angle
Copper Alloy
0.5A
-
Gold
-
-
200
0.6mm
-
-
Surface Mount
-
LCP
-
DDR
Surface Mount
-40°C
Yes
-
-
85°C
30mΩ
UL 94V-0
-
-
-
DDR SODIMM
-
1.8V
-
-
Amphenol ICC
-
DIMM Socket
SODIMM
-
Straight
Copper Alloy
-
-
Gold
-
-
200
0.6mm
-
-
Surface Mount
-
LCP
-
DDR2
Surface Mount
-55°C
Yes
-
3mm
85°C
-
UL 94V-0
-
-
-
10116658
-
50V
-
-
Amphenol ICC
-
DIMM Socket
DDR3
-
Vertical
Copper Alloy
-
-
Gold
-
-
240
1mm
-
-
Board
-
High Temperature Thermoplastic
-
DDR3
Through Hole
-55°C
Yes
-
5.7mm
85°C
-
RoHS Compliant
-
-
-
10078239
-
1.3V
-
-
Amphenol ICC
-
DIMM Socket
DDR3
-
Vertical
Copper Alloy
-
-
Gold
-
-
240
1mm
-
-
Through Hole
-
High Temperature Thermoplastic
-
DDR3
Through Hole
-55°C
Yes
-
3mm
85°C
-
JEDEC MO-269
-
-
-
10081530
-
1.5V
-
-
Amphenol ICC
-
DIMM Socket
DDR3
-
Vertical
Copper Alloy
-
-
Gold
-
-
240
1mm
-
-
Through Hole
-
High Temperature Thermoplastic
-
DDR3
Through Hole
-55°C
Yes
-
3mm
85°C
-
JEDEC MO-269
-
-
-
10081530
-
1.5V
-
-
Molex
-
Socket
MiniDIMM
Latched
Right Angle
Brass Phosphor Bronze
1A
-
Gold
-
-
244
0.6mm
-
-
Surface Mount
-
High Temperature Thermoplastic
-
-
Surface Mount
-55°C
Yes
-
-
85°C
-
CSA LR19980
-
-
-
78001
-
30V
-
-
Molex
-
Socket
MiniDIMM
Latched
Straight
Copper Alloy
1A
-
Gold
-
-
244
0.60mm
-
-
Surface Mount
-
High Temperature Thermoplastic
-
DDR2
Surface Mount
-10°C
Yes
-
-
85°C
-
UL E29179
-
-
-
78035
-
30V
-
-
Molex
-
Socket
DDR3
Latched
Straight
Copper Alloy
1A
-
Gold
-
-
244
0.60mm
-
-
Surface Mount
-
High Temperature Thermoplastic
-
DDR3
Surface Mount
-55°C
Yes
-
-
85°C
-
UL E29179
-
-
-
78035
-
30V
-
-
Molex
-
Socket
DIMM
Latched
Vertical
Copper Alloy
0.75A
-
Gold
-
-
288
0.85mm
-
-
Press Fit
-
High Performance Polyamide (Nylon) Resins
-
DDR4
Press Fit
-55°C
Yes
-
1.58mm
85°C
-
CSA LR19980
-
-
-
78731
-
29V
-
-
Molex
-
Socket
DIMM
Latched
Vertical
Copper Alloy
0.75A
-
Gold
-
-
288
0.85mm
-
-
Through Hole
-
Nylon
-
DDR4
Through Hole
-55°C
Yes
-
1.58mm
85°C
-
CSA LR19980
-
-
-
78726
-
29V
-
-
Molex
-
Socket
DIMM
Latched
Vertical
Copper Alloy
0.75A
-
Gold
-
-
288
0.85mm
-
-
Through Hole
-
Nylon
-
DDR4
Through Hole
-55°C
Yes
-
1.58mm
85°C
-
CSA LR19980
-
-
-
78726
-
29V
-
-
Molex
-
Socket
DIMM
Latched
Vertical
Copper Alloy
0.75A
-
Gold over Tin
-
-
288
0.85mm
-
-
Through Hole
-
Nylon
-
DDR4
Through Hole
-55°C
Yes
-
1.58mm
85°C
-
CSA LR19980
-
-
-
78726
-
29V
-
-
Molex
-
Socket
DIMM
Latched
Vertical
Copper Alloy
0.75A
-
Gold
-
-
288
0.85mm
-
-
Through Hole
-
Nylon
-
DDR4
Through Hole
-55°C
Yes
-
1.58mm
85°C
-
CSA LR19980
-
-
-
78726
-
29V
-
-
Molex
-
Socket
DIMM
Latched
25°
Copper Alloy
1A
-
Gold
-
-
240
1mm
-
-
Through Hole
-
High Temperature Thermoplastic
-
DDR3
Through Hole
-55°C
Yes
-
-
85°C
-
IEC-62474
-
-
-
78373
-
30V
-
-
Molex
-
Socket
DIMM
Latched
Vertical
Copper Alloy
1A
-
Gold
-
-
240
1mm
-
-
Through Hole
-
Nylon
-
DDR3
Press Fit
-55°C
Yes
-
-
85°C
-
UL E29179
-
-
-
78315
-
30V
-
-
Molex
-
Socket
DIMM
-
Vertical
Copper Alloy
1A
-
Gold
-
-
240
1mm
-
-
Through Hole
-
Nylon
-
DDR3
Pin
-55°C
Yes
-
-
85°C
-
RoHS Compliant
-
-
-
78315
-
30V
-
-
TE Connectivity
-
DIMM Socket
Memory Card
-
Right Angle
Copper Alloy
0.5A
-
Gold
-
-
260
0.5mm
-
-
Board
-
High Temperature Thermoplastic
-
DDR4
Surface Mount
-55°C
Yes
-
8.2mm
85°C
10mΩ
UL 94V-0
-
-
-
DDR4 SODIMM
-
1.2V
-
-
TE Connectivity
-
DIMM Socket
Memory Card
-
Right Angle
Copper Alloy
0.5A
-
Gold
-
-
260
0.5mm
-
-
Board
-
High Temperature Thermoplastic
-
DDR4
Surface Mount
-55°C
Yes
-
8.2mm
85°C
50mΩ
UL 94V-0
-
-
-
DDR4 SODIMM
-
1.2V
-
-
TE Connectivity
-
DIMM Socket
Memory Card
-
Right Angle
Copper Alloy
0.5A
-
Gold
-
-
260
0.5mm
-
-
Board
-
High Temperature Thermoplastic
-
DDR4
Surface Mount
-55°C
Yes
-
8.2mm
85°C
50mΩ
UL 94V-0
-
-
-
DDR4 SODIMM
-
1.2V
-
-
TE Connectivity
-
Socket
Memory Card
Cam-In
Straight
Copper Alloy
0.5A
-
Gold Flash
-
-
200
0.6mm
-
-
Board
-
High Temperature Thermoplastic
-
DDR
Surface Mount
-55°C
-
-
6.2mm
85°C
-
UL 94V-0
-
-
-
DDR2 SO DIMM
-
2.5V
-
-
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